Power generation module and wiring substrate

ABSTRACT

This power generation module includes: a power generating portion ( 30 ) including a power generating element ( 19 ); and a wiring substrate. The wiring substrate includes: a reinforcement plate; and a flexible printed circuit ( 79 ) provided above the reinforcement plate. The flexible printed circuit ( 79 ) has: an FPC land portion ( 70 ) configured to have the power generating portion ( 30 ) mounted thereto; and a FPC wire portion ( 73 ) connected to the FPC land portion ( 70 ). The width of the FPC wire portion ( 73 ) is smaller than the width of the FPC land portion ( 70 ).

TECHNICAL FIELD

The present invention relates to power generation modules and wiringsubstrates, and in particular, relates to a power generation moduleincluding a flexible printed circuit and a wiring substrate.

BACKGROUND ART

There have been developed concentrator photovoltaic apparatuses in whichsunlight is converged onto solar cell elements by use of lenses and thelike to increase the power generating efficiency of the solar cellelements.

As one example of a concentrator photovoltaic apparatus, JapaneseLaid-Open Patent Publication No. 2013-84855 (PATENT LITERATURE 1)discloses a technology as below. That is, a concentrator solar cellmodule includes: a plurality of solar cell elements; an elongatedreceiver substrate having the solar cell elements arranged thereon in asingle line at constant intervals; and a module substrate having aplurality of the receiver substrates arranged thereon in parallel atconstant intervals. In the concentrator solar cell module, each receiversubstrate includes: an elongated receiver base; and a plurality ofwiring members arranged on the receiver base in a single line along thelongitudinal direction, with their adjacent ends facing each other. Apositive electrode pad portion is provided on one end of each wiringmember, and a negative electrode pad portion is provided on the otherend thereof. The positive electrode terminal of each solar cell elementis connected to the positive electrode pad portion and the negativeelectrode terminal of the solar cell element is connected to thenegative electrode pad portion, whereby a solar cell element mountingportion is formed.

CITATION LIST Patent Literature

PATENT LITERATURE 1: Japanese Laid-Open Patent Publication No.2013-84855

SUMMARY OF INVENTION Technical Problem

For example, in the concentrator solar cell module described in PATENTLITERATURE 1, when sunlight is converged onto a solar cell element by alens, the temperature of the solar cell element becomes high. Heat ofthe solar cell element is transferred to the receiver substrate to whichthe solar cell element is mounted, and thus, the receiver substrateexpands due to heat in some cases.

For example, in a configuration in which the receiver substrate isadhered to a member, the receiver substrate is detached from the memberdue to influence of dew condensation or the like in some cases.

Then, if the position of the solar cell element is shifted from thefocal point of the lens as a result of deformation due to thermalexpansion of the receiver substrate or detachment of the receiversubstrate due to dew condensation or the like, the power generatingefficiency of the solar cell element is decreased in some cases.

The present invention has been made in order to solve the above problem.An object of the present invention is to provide a power generationmodule and a wiring substrate that can suppress decrease in the powergenerating efficiency due to influence of heat, influence of dewcondensation, or the like.

Solution to Problem

(1) A power generation module according to an aspect of the presentinvention includes: a power generating portion including a powergenerating element; and a wiring substrate, wherein the wiring substrateincludes: a reinforcement plate; and a flexible printed circuit providedabove the reinforcement plate, the flexible printed circuit has: an FPCland portion configured to have the power generating portion mountedthereto; and an FPC wire portion connected to the FPC land portion, anda width of the FPC wire portion is smaller than a width of the FPC landportion.

(16) A wiring substrate according to an aspect of the present inventionis configured to have a power generating portion mounted thereto, thewiring substrate including a land portion and a wire portion, whereinthe land portion has a shape that allows the power generating portion tobe mounted to the land portion, a width of the wire portion is smallerthan a width of the land portion, each of the land portion and the wireportion includes: a reinforcement plate formed of metal; and a flexibleprinted circuit provided above the reinforcement plate, the land portionhas a first region and a second region, the first region has a firstwidth, the second region is positioned at at least one end in a lengthdirection of the land portion, the second region being connected to thefirst region, the second region having a second width, the first widthis greater than the second width, and an angle between an edge of thefirst region and an edge of the second region is greater than 90 degreesand not greater than 170 degrees, the edge of the first region beingpositioned at an end of the first region in a width direction of theland portion, the edge of the second region being positioned at an endof the second region in the width direction, the edge of the secondregion being connected to the edge of the first region.

(17) A wiring substrate according to another aspect of the presentinvention is configured to have a power generating portion mountedthereto, the wiring substrate including a land portion and a wireportion, wherein the land portion has a shape that allows the powergenerating portion to be mounted to the land portion, a width of thewire portion is smaller than a width of the land portion, each of theland portion and the wire portion includes: a reinforcement plate formedof metal; and a flexible printed circuit provided above thereinforcement plate, the land portion has a first region and a secondregion, the first region has a first width, the second region ispositioned at at least one end in a length direction of the landportion, the second region being connected to the first region, thesecond region having a second width, the first width is greater than thesecond width, and a connection portion between an edge of the firstregion and an edge of the second region is a curve, the edge of thefirst region being positioned at an end of the first region in a widthdirection of the land portion, the edge of the second region beingpositioned at an end of the second region in the width direction, theedge of the second region being connected to the edge of the firstregion.

Advantageous Effects of Invention

According to the present invention, it is possible to suppress decreasein the power generating efficiency due to influence of heat, influenceof dew condensation, or the like.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a perspective view of a photovoltaic apparatus according to afirst embodiment of the present invention.

FIG. 2 is a perspective view of the photovoltaic module according to thefirst embodiment of the present invention.

FIG. 3 is a plan view of the photovoltaic module according to the firstembodiment of the present invention.

FIG. 4 is a plan view showing a state of the photovoltaic module with aconcentrating portion removed according to the first embodiment of thepresent invention.

FIG. 5 is a perspective view showing a state of a power generatingportion mounted to a wiring substrate according to the first embodimentof the present invention.

FIG. 6 is a cross-sectional view showing a cross section, along a VI-VIline in FIG. 4, of the photovoltaic module according to the firstembodiment of the present invention.

FIG. 7 is a cross-sectional view of a cross section, along a VII-VIIline in FIG. 4, of a wiring module and the power generating portion inthe photovoltaic module according to the first embodiment of the presentinvention.

FIG. 8 shows a pattern of a conductive portion of an FPC in the wiringsubstrate according to the first embodiment of the present invention.

FIG. 9 shows the wiring substrate according to the first embodiment ofthe present invention.

FIG. 10 shows the FPC in the wiring substrate according to the firstembodiment of the present invention.

FIG. 11 shows a reinforcement plate in the wiring substrate according tothe first embodiment of the present invention.

FIG. 12 shows the wiring module with the wiring substrate according tothe first embodiment of the present invention.

FIG. 13 shows a modification of the wiring substrate according to thefirst embodiment of the present invention.

FIG. 14 shows a modification of the wiring substrate according to thefirst embodiment of the present invention.

FIG. 15 shows a modification of the wiring substrate according to thefirst embodiment of the present invention.

FIG. 16 shows a modification of the wiring substrate according to thefirst embodiment of the present invention.

FIG. 17 shows a modification of the FPC in the wiring substrateaccording to the first embodiment of the present invention.

FIG. 18 shows a modification of the FPC in the wiring substrateaccording to the first embodiment of the present invention.

FIG. 19 shows a modification of the FPC in the wiring substrateaccording to the first embodiment of the present invention.

FIG. 20 shows a modification of the FPC in the wiring substrateaccording to the first embodiment of the present invention.

FIG. 21 is a perspective view showing a state of the power generatingportion mounted to the wiring substrate according to a second embodimentof the present invention.

FIG. 22 is a cross-sectional view showing a cross section, along a linethat corresponds to the VI-VI line in FIG. 4, of the photovoltaic moduleaccording to the second embodiment of the present invention.

FIG. 23 is a cross-sectional view showing a cross section, along a linethat corresponds to the VII-VII line in FIG. 4, of the wiring module andthe power generating portion in the photovoltaic module according to thesecond embodiment of the present invention.

FIG. 24 shows the wiring substrate according to the second embodiment ofthe present invention.

DESCRIPTION OF EMBODIMENTS

First, contents of embodiments of the present invention will be listedfor description.

(1) A power generation module according to an embodiment of the presentinvention includes: a power generating portion including a powergenerating element; and a wiring substrate, wherein the wiring substrateincludes: a reinforcement plate; and a flexible printed circuit providedabove the reinforcement plate, the flexible printed circuit has: an FPCland portion configured to have the power generating portion mountedthereto; and an FPC wire portion connected to the FPC land portion, anda width of the FPC wire portion is smaller than a width of the FPC landportion.

With this configuration, the wiring substrate having a certain degree offlexibility can be further provided with a feature that the FPC wireportion more easily bends than the FPC land portion. Accordingly, forexample, even in a case where compressive stress in the extendingdirection is applied to the wiring substrate as a result of thermalexpansion of the wiring substrate, the FPC wire portion bends so as toabsorb the expansion in the extending direction, whereby deformation andpositional shift of the FPC land portion can be prevented. Accordingly,for example, in a case where a lens having its focal point set at thepower generating portion is provided above the power generating portionmounted to the FPC land portion, the position of the power generatingportion can be prevented from being shifted from the focal point of thelens. Therefore, decrease in the power generating efficiency due toinfluence of heat can be suppressed.

(2) Preferably, the FPC land portion has a length along an extendingdirection of the wiring substrate, the FPC wire portion has a lengthalong the extending direction of the wiring substrate, and the length ofthe FPC wire portion is greater than the length of the FPC land portion.

This configuration allows the FPC wire portion to more easily bend thanthe FPC land portion. Thus, the position of the power generating portioncan be more reliably prevented from being shifted from the focal pointof the lens.

(3) More preferably, the length of the FPC wire portion is greater than100% and not greater than 600% of the length of the FPC land portion.

With this configuration, it is possible to make the land portion lesslikely to bend than the wire portion, while causing the land portion tohave a size that allows the power generating portion to be mountedthereto.

(4) Preferably, the width of the FPC wire portion is not less than 0.1%and not greater than 50% of the width of the FPC land portion.

With this configuration, for example, the width of the wire portion canbe reduced relative to the width of the land portion. Thus, it ispossible to provide the wire portion with a feature that the wireportion more easily bends than the land portion. In addition, the widthof the wire portion can be increased to an extent that the strength ofthe wire portion does not pose a problem.

(5) Preferably, the FPC land portion has a first region and a secondregion, the first region has a first width, the second region ispositioned at at least one end in a length direction of the FPC landportion, the second region being connected to the first region, thesecond region having a second width, and the second width is smallerthan the first width and is greater than the width of the FPC wireportion.

With this configuration, for example, heat transferred from the powergenerating portion to the first region can be efficiently dissipated viathe second region to the wire portion.

(6) Preferably, the FPC land portion has a first region and a secondregion, the first region has a first width, the second region ispositioned at each of both ends in a length direction of the FPC landportion, the second region being connected to the first region, thesecond region having a second width, and the second width is smallerthan the first width and is greater than the width of the FPC wireportion.

With this configuration, heat in the first region can be dissipated toboth of the wire portions connected to the respective second regions.

(7) More preferably, the second width becomes smaller from the firstregion toward the FPC wire portion.

With this configuration, heat in the second region can be efficientlydissipated to the wire portion.

(8) More preferably, the second region has a length along an extendingdirection of the wiring substrate, and relationship between the secondwidth and the length of the second region satisfies a formula below,

0<(Lf12/Wf2)≦10

where Wf2 is the second width and Lf12 is the length of the secondregion.

With this configuration, heat in the second region can be moreefficiently dissipated to the wire portion.

(9) More preferably, in a plan view from above the wiring substrate, thepower generating portion is disposed such that a center portion of thepower generating portion is included in the first region.

With this configuration, the power generating portion can be disposed ata position separated to some extent from the wire portion. Thus,positional shift of the power generating portion due to influence ofbending of the wire portion can be more reliably prevented.

(10) Preferably, an area of the FPC land portion is not less than 20%and not greater than 1000% of an area of the FPC wire portion.

With this configuration, it is possible to make the land portion lesslikely to bend than the wire portion, while causing the land portion tohave a size that allows the power generating portion to be mountedthereto.

(11) Preferably, the reinforcement plate has: a land reinforcementportion fixed to the FPC land portion; and a wire reinforcement portionfixed to the FPC wire portion, and a width of the wire reinforcementportion is smaller than a width of the land reinforcement portion.

This configuration allows the wire portion to more easily bend than theland portion.

(12) More preferably, the reinforcement plate is adhered to a baseportion by an adhesive layer, the adhesive layer has: a land adhesionregion configured to adhere the land reinforcement portion to the baseportion; and a wire adhesion region configured to adhere the wirereinforcement portion to the base portion, and a width of the wireadhesion region is smaller than a width of the land adhesion region.

With this configuration, in a state where the wiring substrate isadhered to the base portion, the wire reinforcement portion is allowedto be more easily detached from the base portion, than the landreinforcement portion. Accordingly, for example, even when compressivestress in the extending direction is applied to the wiring substrate asa result of thermal expansion of the wiring substrate, the wirereinforcement portion and the wire portion which are in a state of beingfixed to each other bend while being detached from the base portion soas to absorb the expansion in the extending direction. Accordingly,deformation and positional shift of the land portion can be prevented.

(13) Preferably, the FPC land portion has a first region and a secondregion, the first region has a first width, the second region ispositioned at at least one end in a length direction of the FPC landportion, the second region being connected to the first region, thesecond region having a second width, the first width is greater than thesecond width, and an angle between an edge of the first region and anedge of the second region is greater than 90 degrees and not greaterthan 170 degrees, the edge of the first region being positioned at anend of the first region in a width direction of the FPC land portion,the edge of the second region being positioned at an end of the secondregion in the width direction, the edge of the second region beingconnected to the edge of the first region.

Thus, with the configuration in which the angle in the land portion isset to be an obtuse angle, for example, in a case where the flexibleprinted circuit and the reinforcement plate in the wiring substrate areadhered to each other, it is possible to suppress detachment between theflexible printed circuit and the reinforcement plate at a corner of theland portion due to influence of dew condensation or the like.

(14) Preferably, the FPC land portion has a first region and a secondregion, the first region has a first width, the second region ispositioned at at least one end in a length direction of the FPC landportion, the second region being connected to the first region, thesecond region having a second width, the first width is greater than thesecond width, and a connection portion between an edge of the firstregion and an edge of the second region forms a curve, the edge of thefirst region being positioned at an end of the first region in a widthdirection of the FPC land portion, the edge of the second region beingpositioned at an end of the second region in the width direction, theedge of the second region being connected to the edge of the firstregion.

Thus, with the configuration in which roundness is provided to the landportion to reduce corners, it is possible to more reliably preventdetachment between the flexible printed circuit and the reinforcementplate due to influence of dew condensation or the like.

(15) More preferably, the connection portion between the edge of thefirst region and the edge of the second region forms a continuous curve.

This configuration can make smoother the periphery of the land portion.Thus, it is possible to more reliably prevent detachment between theflexible printed circuit and the reinforcement plate due to influence ofdew condensation or the like.

(16) A wiring substrate according to an embodiment of the presentinvention is configured to have a power generating portion mountedthereto, the wiring substrate including a land portion and a wireportion, wherein the land portion has a shape that allows the powergenerating portion to be mounted to the land portion, a width of thewire portion is smaller than a width of the land portion, each of theland portion and the wire portion includes: a reinforcement plate formedof metal; and a flexible printed circuit provided above thereinforcement plate, the land portion has a first region and a secondregion, the first region has a first width, the second region ispositioned at at least one end in a length direction of the landportion, the second region being connected to the first region, thesecond region having a second width, the first width is greater than thesecond width, and an angle between an edge of the first region and anedge of the second region is greater than 90 degrees and not greaterthan 170 degrees, the edge of the first region being positioned at anend of the first region in a width direction of the land portion, theedge of the second region being positioned at an end of the secondregion in the width direction, the edge of the second region beingconnected to the edge of the first region.

Thus, with the configuration in which the angle in the land portion isset to be an obtuse angle, for example, in a case where the flexibleprinted circuit and the reinforcement plate in the wiring substrate areadhered to each other, it is possible to suppress detachment between theflexible printed circuit and the reinforcement plate at a corner of theland portion due to influence of dew condensation or the like. Inaddition, in a case where the wiring substrate and the base portion atwhich the wiring substrate is placed are adhered to each other, it ispossible to suppress detachment of the land portion from the baseportion due to influence of dew condensation or the like. Therefore, itis possible to suppress decrease in the power generating efficiency dueto influence of dew condensation or the like.

(17) A wiring substrate according to an embodiment of the presentinvention is configured to have a power generating portion mountedthereto, the wiring substrate including a land portion and a wireportion, wherein the land portion has a shape that allows the powergenerating portion to be mounted to the land portion, a width of thewire portion is smaller than a width of the land portion, each of theland portion and the wire portion includes: a reinforcement plate formedof metal; and a flexible printed circuit provided above thereinforcement plate, the land portion has a first region and a secondregion, the first region has a first width, the second region ispositioned at at least one end in a length direction of the landportion, the second region being connected to the first region, thesecond region having a second width, the first width is greater than thesecond width, and a connection portion between an edge of the firstregion and an edge of the second region is a curve, the edge of thefirst region being positioned at an end of the first region in a widthdirection of the land portion, the edge of the second region beingpositioned at an end of the second region in the width direction, theedge of the second region being connected to the edge of the firstregion.

Thus, with the configuration in which roundness is provided to the landportion to reduce corners, for example, in a case where the flexibleprinted circuit and the reinforcement plate are adhered to each other inthe wiring substrate, it is possible to suppress detachment between theflexible printed circuit and the reinforcement plate due to influence ofdew condensation or the like. In addition, in a case where the wiringsubstrate and the base portion at which the wiring substrate is placedare adhered to each other, it is possible to suppress detachment of theland portion from the base portion due to influence of dew condensationor the like. Therefore, it is possible to suppress decrease in the powergenerating efficiency due to influence of dew condensation or the like.

(18) Preferably, the connection portion between the edge of the firstregion and the edge of the second region forms a continuous curve.

This configuration can make further smoother the periphery of the landportion. Thus, it is possible to more reliably prevent detachmentbetween the flexible printed circuit and the reinforcement plate due toinfluence of dew condensation or the like. In addition, it is possibleto more reliably prevent detachment of the land portion from the baseportion due to influence of dew condensation or the like.

Hereinafter, embodiments of the present invention will be described withreference to the drawings. It should be noted that the same orcorresponding parts are denoted by the same reference signs, anddescription thereof is not repeated. At least some parts of theembodiments descried below can be combined together as desired.

First Embodiment

FIG. 1 is a perspective view of a photovoltaic apparatus according to afirst embodiment of the present invention.

With reference to FIG. 1, a photovoltaic apparatus 101 includes aphotovoltaic panel 12 and a pedestal 40. The photovoltaic panel 12includes a plurality of photovoltaic modules 10, a sun direction sensor13, and a frame part 14. The pedestal 40 includes a base 46, a post 48,a function part 90, and a position changeable part not shown. Thephotovoltaic apparatus 101 is a concentrator photovoltaic apparatus, forexample.

The photovoltaic panel 12 includes 5 rows×5 columns of the photovoltaicmodules 10, i.e., 25 photovoltaic modules 10, for example. Thephotovoltaic modules 10 are mounted side by side on top of the framepart 14.

Each photovoltaic module 10 receives sunlight to generate power, andoutputs, by using wiring not shown, direct-current power which is thegenerated power, to the function part 90 mounted to a side face of thepost 48.

The post 48 is set, for example, on the base 46 provided on the ground,so as to be perpendicular to the ground.

The position changeable part not shown includes a motor. On the basis ofa control signal from the function part 90, the position changeable partoperates so as to direct toward the sun the direction of a lightreceiving surface FL of the photovoltaic panel 12, i.e., the directionof the normal line of the light receiving surface FL indicated by anarrow As. Accordingly, the orientation of the light receiving surface FLof the photovoltaic panel 12 changes so as to track the sun from sunrisetill sunset.

The sun direction sensor 13 is used for detecting the direction of thesun, and outputs a sensor signal indicating the detection result, to thefunction part 90.

For example, the function part 90 includes a housing and various typesof units accommodated in the housing. Specifically, for example, thehousing accommodates: a junction box which connects wires from therespective photovoltaic modules 10; a power conditioner which convertsdirect-current power outputted from the photovoltaic modules 10, intoalternating-current power; a control unit for controlling theorientation of the light receiving surface FL of the photovoltaic panel12; and the like.

FIG. 2 is a perspective view of the photovoltaic module according to thefirst embodiment of the present invention. FIG. 3 is a plan view of thephotovoltaic module according to the first embodiment of the presentinvention.

With reference to FIG. 2 and FIG. 3, the photovoltaic module 10 includesa wall portion 27, a bottom not shown, and a concentrating portion 25.The concentrating portion 25 includes a plurality of Fresnel lenses 26.

In the concentrating portion 25, the Fresnel lenses 26 are arranged in asquare lattice pattern, for example. Specifically, the Fresnel lenses 26are arranged such that the distance between the centers of Fresnellenses 26 that are adjacent to each other is W1, for example. The sizeof each Fresnel lens 26 is 50 mm×50 mm, for example.

FIG. 4 is a plan view showing a state of a photovoltaic module with theconcentrating portion removed according to the first embodiment of thepresent invention.

With reference to FIG. 4, the photovoltaic module 10 includes the wallportion 27, a wiring module 49, a plurality of power generating portions30, and two lead wires 39. The wiring module 49 includes: a base portion38 being the bottom of the photovoltaic module 10; and a wiringsubstrate 69.

The wiring substrate 69 includes: strip-shaped substrates 32A, 32B, 32C,32D, 32E, 32F, 32G, 32H, 32I, and 32J; and coupling portions 33H, 33I,33J, 33K 33L 33M, 33N, 33O, and 33P.

The coupling portion 33H couples the strip-shaped substrate 32A and thestrip-shaped substrate 32B together. The coupling portion 33I couplesthe strip-shaped substrate 32B and the strip-shaped substrate 32Ctogether. The coupling portion 33J couples the strip-shaped substrate32C and the strip-shaped substrate 32D together. The coupling portion33K couples the strip-shaped substrate 32D and the strip-shapedsubstrate 32E together. The coupling portion 33L couples thestrip-shaped substrate 32E and the strip-shaped substrate 32F together.The coupling portion 33M couples the strip-shaped substrate 32F and thestrip-shaped substrate 32G together. The coupling portion 33N couplesthe strip-shaped substrate 32G and the strip-shaped substrate 32Htogether. The coupling portion 33O couples the strip-shaped substrate32H and the strip-shaped substrate 32I together. The coupling portion33P couples the strip-shaped substrate 32I and the strip-shapedsubstrate 32J together.

Hereinafter, each of the strip-shaped substrates 32A, 32B, 32C, 32D,32E, 32F, 32G, 32H, 32I, and 32J will also be referred to as astrip-shaped substrate 32. In addition, each of the coupling portions33H, 33I, 33J, 33K, 33L, 33M, 33N, 33O, and 33P will also be referred toas a coupling portion 33. The strip-shaped substrates 32 are arrangedparallel to each other.

It should be noted that the wiring substrate 69 may be configured toinclude a larger number of or a smaller number of the strip-shapedsubstrates 32. For example, the wiring substrate 69 may be configured toinclude a single strip-shaped substrate 32.

The wiring substrate 69, specifically, each strip-shaped substrate 32 ofthe wiring substrate 69 has an elongated shape. The strip-shapedsubstrate 32 of the wiring substrate 69 has a length along the extendingdirection. The wiring substrate 69 has a thickness. The wiring substrate69 has a width along a direction that crosses the length direction andthe thickness direction of the wiring substrate 69.

The lead wires 39 are respectively connected to the two ends of thewiring substrate 69. The lead wires 39 respectively pass through holesprovided in the base portion 38, and are connected to the junction boxin the function part 90 shown in FIG. 1, for example. The material ofthe base portion 38 is, for example, aluminium, copper, or the likewhich has a high heat conductivity and a relatively light weight.

The wiring substrate 69 is placed at and adhered to the upper mainsurface of the base portion 38, i.e., the main surface on the Fresnellens 26 side of the base portion 38.

In the wiring module 49, the strip-shaped substrate 32 of the wiringsubstrate 69 includes seven land portions 60 and wire portions 63 eachconnected to opposite sides of each land portion. Each wire portion 63connects the land portions 60 together, for example. The width of theland portion 60 is greater than the width of the wire portion 63.

Each power generating portion 30 is mounted to the upper main surface ofits corresponding land portion 60. It should be noted that thestrip-shaped substrate 32 in the wiring substrate 69 may be configuredto include a larger number of or a smaller number of the land portions60 and the wire portions 63. For example, the strip-shaped substrate 32may be configured to include a single land portion 60 and a single wireportion 63.

For example, the strip-shaped substrate 32E includes power generatingportions 30P1, 30Q1, and 30R1 mounted thereto as the power generatingportions 30. The strip-shaped substrate 32F includes power generatingportions 30P2, 30Q2, and 30R2 mounted thereto as the power generatingportions 30.

The power generating portion 30P1 and the power generating portion 30P2are arranged along a direction perpendicular to the extending directionof the strip-shaped substrate 32 and are adjacent to each other. Thepower generating portion 30Q1 and the power generating portion 30Q2 arearranged along a direction perpendicular to the extending direction ofthe strip-shaped substrate 32 and are adjacent to each other. The powergenerating portion 30R1 and the power generating portion 30R2 arearranged along a direction perpendicular to the extending direction ofthe strip-shaped substrate 32 and are adjacent to each other.

A distance W2 between the power generating portions 30 that are arrangedalong a direction perpendicular to the extending direction of thestrip-shaped substrate 32 and that are adjacent to each other is equalto a distance W3 between the power generating portions 30 that areadjacent to each other in the strip-shaped substrate 32. Specifically,for example, the distance W2 between the power generating portion 30P1and the power generating portion 30P2 is equal to the distance W3between the power generating portion 30P2 and power generating portion30Q2.

For example, the distance W2 and the distance W3 are equal to thedistance W1 between the centers of the Fresnel lenses 26 shown in FIG.3.

For example, each Fresnel lenses 26 shown in FIG. 3 is provided for onepower generating portion 30, correspondingly. Each power generatingportion 30 is disposed on the optical axis of its corresponding Fresnellens 26.

The photovoltaic module 10 includes a power generation module 29. Thepower generation module 29 includes: the wiring substrate 69 and thepower generating portions 30 mounted to the wiring substrate 69. In thepower generation module 29, the wiring substrate 69 includes the landportions 60 and the wire portions 63 described above.

FIG. 5 is a perspective view showing a state of the power generatingportion mounted to the wiring substrate according to the firstembodiment of the present invention.

With reference to FIG. 5, the wiring substrate 69 includes an FPC(flexible printed circuit) 79, and a reinforcement plate 89. The FPC 79includes a conductive portion 77 and an insulating portion 78 whichcovers the conductive portion 77.

The power generating portion 30 is mounted to the land portion 60 of thewiring substrate 69. Specifically, in the land portion 60, an opening 68is provided in the FPC 79. In the opening 68, the insulating portion 78does not cover the upper side of the conductive portion 77, and thus,the conductive portion 77 is exposed. The power generating portion 30 iselectrically connected to the conductive portion 77 in the opening 68.

The reinforcement plate 89 is provided to the main surface on the baseportion 38 side of the strip-shaped substrate 32 in the wiring substrate69, and provides slight hardness to the strip-shaped substrate 32,thereby facilitating handling of the wiring substrate 69 duringproduction of the photovoltaic module 10. The reinforcement plate 89 isformed of metal such as aluminium, copper, or the like.

FIG. 6 is a cross-sectional view showing a cross section, along theVI-VI line in FIG. 4, of the photovoltaic module according to the firstembodiment of the present invention.

With reference to FIG. 6, each power generating portion 30 includes aball lens 17, a package 18, and a power generating element 19. It shouldbe noted that the power generating portion 30 may be configured not toinclude, except the power generating element 19, any or some of thesecomponents.

The wiring substrate 69 is placed at the upper main surface of the baseportion 38. The reinforcement plate 89 is provided above the baseportion 38. The FPC 79 is provided above the reinforcement plate 89.Specifically, the FPC 79 is provided above the base portion 38 via thereinforcement plate 89.

The power generating element 19 is housed in the package 18. The powergenerating element 19 is mounted to the FPC 79 in a state of beinghoused in the package 18. Specifically, an electrode not shown of thepower generating element 19 is connected to the conductive portion 77 ofthe FPC 79, via a package electrode 20 provided so as to penetrate thebottom of the package 18. The size of power generating element 19 is 3.2mm×3.2 mm, for example.

Each Fresnel lens 26 converges sunlight onto its corresponding ball lens17. The ball lens 17 further converges the sunlight converged by theFresnel lens 26, onto the power generating element 19.

The power generating element 19 receives the sunlight converged by theFresnel lens 26 and the ball lens 17, and generates power correspondingto the amount of the received light.

FIG. 7 is a cross-sectional view showing a cross section, along theVII-VII line in FIG. 4, of the wiring module and the power generatingportion in the photovoltaic module according to the first embodiment ofthe present invention.

FIG. 7 also shows an adhesive layer not shown in FIG. 5, for example.

Specifically, with reference to FIG. 7, the power generating portion 30is mounted to the wiring module 49, specifically, to the wiringsubstrate 69 of the wiring module 49. In the wiring substrate 69, theFPC 79 and the reinforcement plate 89 are adhered together by anintra-substrate adhesive layer 58. The wiring substrate 69 and the baseportion 38 are adhered together by a base adhesive layer 59. Theintra-substrate adhesive layer 58 and the base adhesive layer 59 areeach formed from an adhesive agent, an adhesive tape, or the like, forexample.

The power generating element 19 includes an element electrode 42A and anelement electrode 42B, and outputs voltage from the element electrode42A and the element electrode 42B.

The package 18 includes a package electrode 20A and a package electrode20B. The package electrode 20A and the package electrode 20B areprovided so as to penetrate the bottom of the package 18, and areexposed both on the upper side and the lower side of the bottom.

The element electrode 42A of the power generating element 19 isconnected to the package electrode 20A by wire bonding, for example. Theelement electrode 42B is connected to the package electrode 20B by aconductive paste, for example.

In the opening 68 in the FPC 79, the insulating portion 78 does notcover the upper side of the conductive portion 77, and thus, a part ofthe conductive portion 77, specifically, a part of a conductive portion77A and a part of a conductive portion 77B, is exposed.

The package electrode 20A and the package electrode 20B are connectedby, for example, soldering to the conductive portion 77A and theconductive portion 77B, respectively.

The package 18 supports the ball lens 17 at the edge of the side wall ofthe package 18, and fixes the focal point of the ball lens 17 to thepower generating element 19.

FIG. 8 shows a pattern of the conductive portion of the FPC in thewiring substrate according to the first embodiment of the presentinvention.

With reference to FIG. 8, in the opening 68 of the FPC 79, a part of theconductive portion 77 is exposed. Specifically, in the opening 68, apart of the conductive portion 77A and a part of the conductive portion77B are exposed.

As shown in FIG. 7, for example, the conductive portion 77A and theconductive portion 77B are connected to the element electrode 42A andthe element electrode 42B of the power generating element 19,respectively.

The conductive portion 77 connects, in series, the power generatingportion 30 mounted in a land portion 60 and the power generating portion30 mounted in another land portion 60 adjacent to the land portion 60,for example.

FIG. 9 shows the wiring substrate according to the first embodiment ofthe present invention.

FIG. 9 shows a plan view and a side view of a part of the wiringsubstrate 69, specifically, a part of the strip-shaped substrate 32 inthe wiring substrate 69. With reference to FIG. 9, the wiring substrate69 to which the power generating portions 30 are mounted includes aplurality of the land portions 60 and a plurality of the wire portions63, as described above.

Each land portion 60 has a shape that allows the power generatingportion 30 to be mounted to the upper side of the land portion 60, i.e.,the main surface on the Fresnel lens 26 side of the land portion 60.That is, the land portion 60 has a space that allows the powergenerating portion 30 to be mounted therein. In addition, the landportion 60 has a length Lb1 along the extending direction of the wiringsubstrate 69.

The power generating portion 30 including the power generating element19 is mounted to the land portion 60. The wire portion 63 iselectrically connected to the power generating element 19. The wireportion 63 electrically connects the land portions 60 that are adjacentto each other, i.e., the power generating portions 30 that are adjacentto each other. The wire portion 63 has a length Lb2 along the extendingdirection of the wiring substrate 69.

The length Lb2 of the wire portion 63 is greater than the length Lb1 ofthe land portion 60. That is, the length Lb2 of the wire portion 63 inthe extending direction of the wiring substrate 69 is greater than thelength Lb1 of the land portion 60 in the extending direction.Hereinafter, the extending direction of the wiring substrate 69 willalso be referred to as a substrate extending direction.

A width Wb3 of the wire portion 63 is smaller than a width Wb0 of theland portion 60. The width Wb0 of the land portion 60 and the width Wb3of the wire portion 63 respectively are the length of the land portion60 and the length of the wire portion 63 in a direction that crosses thesubstrate extending direction, specifically, for example, in a directionperpendicular to the substrate extending direction. Hereinafter, thedirection that crosses the substrate extending direction, i.e., thewidth direction of the land portion 60, will also be referred to as asubstrate width direction.

The width Wb0 of the land portion 60 is not less than 200% and notgreater than of 1000% of the width Wb3 of the wire portion 63, forexample.

The length Lb1 in the substrate extending direction of the land portion60 is greater than the width Wb0 of the land portion 60.

For example, the land portion 60 has an inside region 61 and two outsideregions 62. The outside regions 62 are respectively connected to bothends in the substrate extending direction of the inside region 61. Thatis, the outside regions 62 are respectively positioned at both ends inthe length direction of the land portion 60 and connected to the insideregion 61. That is, each outside region 62 is connected between an endin the substrate extending direction of the inside region 61 and a wireportion 63.

The number of the outside regions 62 of the land portion 60 may be one.In this case, the outside region 62 is connected to either one of theends in the substrate extending direction of the inside region 61, forexample. That is, the outside region 62 is positioned at one end in thelength direction of the land portion 60, and is connected to the insideregion 61.

The inside region 61 has a width Wb1 that corresponds to the width Wb0of the land portion 60. The outside region 62 has a width Wb2. The widthWb1 of the inside region 61 and the width Wb2 of the outside region 62are the length of the inside region 61 and the length of the outsideregion 62 in the substrate width direction, respectively.

For example, the width Wb2 of the outside region 62 is smaller than thewidth Wb1 of the inside region 61. In addition, for example, the widthWb2 of the outside region 62 is greater than the width Wb3 of the wireportion 63.

For example, the width Wb2 of the outside region 62 continuously becomessmaller from the inside region 61 toward the wire portion 63. That is,the width Wb2 of the outside region 62 continuously becomes smallertoward the wire portion 63 to which the outside region 62 is connected.

The outside region 62 has a length Lb12 along the extending direction ofthe wiring substrate 69. For example, the relationship between the widthWb2 of the outside region 62 and the length Lb12 of the outside region62, i.e., the length Lb12 in the substrate extending direction of theoutside region 62, is expressed by the formula (1) below.

0<Lb12/Wb2≦10  (1)

For example, an area Sb1 of the inside region 61 is greater than an areaSb2 of the outside region 62. Specifically, for example, the area Sb1 ofthe inside region 61 is not less than 200% and not greater than 1000% ofthe area Sb2 of the outside region 62.

The wiring substrate 69 includes the FPC 79 and the reinforcement plate89 as described above, for example. That is, each land portion 60 andeach wire portion 63 include the reinforcement plate 89.

For example, in a plan view from above the wiring substrate 69,specifically, in a plan view in a direction from above the wiringsubstrate 69 toward the mounting surface for the power generatingportion 30, the land portion 60 has a shape that allows the powergenerating portion 30 to be disposed such that a center portion of thepower generating portion 30, specifically, the center Ce of the powergenerating portion 30, is positioned in the inside region 61. In a planview from above the wiring substrate 69, the power generating portion 30is disposed such that the center Ce of the power generating portion 30is included in the inside region 61.

For example, in a plan view from above the wiring substrate 69, adistance db1 from the power generating portion 30 to the wire portion 63in the substrate extending direction is greater than a distance db2 fromthe power generating portion 30 to an end of the land portion 60 in thesubstrate width direction.

For example, the wiring substrate 69 has an electrode for soldering thepower generating portion 30. Specifically, for example, the electrode isthe exposed portion of the conductive portion 77 in the opening 68 shownin FIG. 8, and is provided so as to be included in the inside region 61.

The land portion 60 has a mounting region 31 that comes into contactwith the power generating portion 30 when the power generating portion30 is mounted to the land portion 60. For example, not less than 80% ofthe mounting region 31 is positioned in the inside region 61. In otherwords, for example, 80% to 100% of the mounting region 31 is included inthe inside region 61, the mounting region 31 being the region where thepower generating portion 30 is mounted in the land portion 60. In theexample shown in FIG. 9, 100% of the mounting region 31 is included inthe inside region 61.

For example, a thickness Tb3 of the wire portion 63 is not less than 1%and not greater than 50% of the width Wb3 of the wire portion 63.

The reinforcement plate 89 has a thickness Ts0. For example, thethickness Ts0 of the reinforcement plate 89 is not less than 10% and notgreater than 90% of a thickness Tb0 of the wiring substrate 69.

The inside region 61 has edges 65. Each edge 65 is positioned at an endof the inside region 61 in the substrate width direction. The outsideregion 62 has edges 66. Each edge 66 is positioned at an end of theoutside region 62 in the substrate width direction.

The edge 65 and the edge 66 are connected to each other. An angle αbetween the edge 65 and the edge 66 is greater than 90 degrees and notgreater than 170 degrees, for example.

FIG. 10 shows the FPC in the wiring substrate according to the firstembodiment of the present invention.

With reference to FIG. 10, the FPC 79 includes a plurality of FPC landportions 70 and a plurality of FPC wire portions 73. The FPC landportion 70 and the FPC wire portion 73 are included in the land portion60 and the wire portion 63 shown in FIG. 9, respectively.

The power generating portion 30 is mounted to the FPC land portion 70.The FPC wire portion 73 connects the FPC land portions 70 together,i.e., the power generating portions 30 together.

The FPC land portion 70 has a length Lf1 along the extending directionof the wiring substrate 69. The FPC wire portion 73 has a length Lf3along the extending direction of the wiring substrate 69. The length Lf3of the FPC wire portion 73 is greater than the length Lf1 of the FPCland portion 70. That is, the length Lf3 in the substrate extendingdirection of the FPC wire portion 73 is greater than the length Lf1 inthe substrate extending direction of the FPC land portion 70.

Specifically, for example, the length Lf3 in the substrate extendingdirection of the FPC wire portion 73 is greater than 100% and notgreater than 600% of the length Lf1 in the substrate extending directionof the FPC land portion 70.

A width Wf3 of the FPC wire portion 73 is smaller than a width Wf0 ofthe FPC land portion 70. Specifically, for example, the width Wf3 of theFPC wire portion 73 is not less than 0.1% and not greater than 50% ofthe width Wf0 of the FPC land portion 70.

For example, an area Sf1 of the FPC land portion 70 is not less than 20%and not greater than 1000% of an area Sf3 of the FPC wire portion 73.

For example, the FPC land portion 70 has an inside region (first region)71 and two outside regions (second regions) 72. The inside region 71 hasa width Wf1. The outside regions 72 each have a width Wf2. The outsideregions 72 are respectively positioned at both ends in the lengthdirection of the FPC land portion 70 and connected to the inside region71.

In other words, for example, the outside regions 72 are respectivelyconnected to both ends in the substrate extending direction of theinside region 71. Specifically, each outside region 72 is connectedbetween an end in the substrate extending direction of the inside region71 and a FPC wire portion 73.

The number of the outside regions 72 of the FPC land portion 70 may beone. In this case, the outside region 72 is connected to either one ofthe ends in the substrate extending direction of the inside region 71.That is, the outside region 72 is positioned at one end in the lengthdirection of the FPC land portion 70, and is connected to the insideregion 71.

The inside region 71 has the width Wf1 that corresponds to the width Wf0of the FPC land portion 70. The outside region 72 has the width Wf2. Thewidth Wf1 of the inside region 71 and the width Wf2 of the outsideregion 72 are the length of the inside region 71 and the length of theoutside region 72 in the substrate width direction, respectively.

For example, the width Wf2 of the outside region 72 is smaller than thewidth Wf1 of the inside region 71. In addition, for example, the widthWf2 of the outside region 72 is greater than the width Wf3 of the FPCwire portion 73.

For example, the width Wf2 of the outside region 72 continuously becomessmaller from the inside region 71 toward the FPC wire portion 73. Thatis, the width Wf2 of the outside region 72 continuously becomes smallertoward the FPC wire portion 73 connected to the outside region 72.

For example, the outside region 72 has a length Lf12 along the extendingdirection of the wiring substrate 69. The relationship between the widthWf2 of the outside region 72 and the length Lf12 of the outside region72, i.e., the length Lf12 in the substrate extending direction of theoutside region 72, is expressed by the formula (2) below.

0<Lf12/Wf2≦10  (2)

For example, in a plan view from above the wiring substrate, the powergenerating portion 30 is disposed such that a center portion of thepower generating portion 30, specifically, the center Ce of the powergenerating portion 30, is included in the inside region 71.

For example, the FPC 79 has an electrode for soldering the powergenerating portion 30. Specifically, for example, the electrode is theexposed portion of the conductive portion 77 in the opening 68 shown inFIG. 8, and is provided so as to be included in the inside region 71.

The inside region 71 has edges 75. Each edge 75 is positioned at an endof the inside region 71 in the width direction of the FPC land portion70, i.e., in the substrate width direction. The outside region 72 hasedges 76. Each edge 76 is positioned at an end of the outside region 72in the substrate width direction.

The edge 75 and the edge 76 are connected to each other. An angle βbetween the edge 75 and the edge 76 is greater than 90 degrees and notgreater than 170 degrees, for example.

FIG. 11 shows the reinforcement plate in the wiring substrate accordingto the first embodiment of the present invention.

With reference to FIG. 11, the reinforcement plate 89 includes landreinforcement portions 80 and wire reinforcement portions 83. The landreinforcement portion 80 and the wire reinforcement portion 83 areincluded in the land portion 60 and the wire portion 63 shown in FIG. 9,respectively.

The land reinforcement portion 80 is adhered to the FPC land portion 70.The wire reinforcement portion 83 is adhered to the FPC wire portion 73.A width Ws3 of the wire reinforcement portion 83 is smaller than a widthWs0 of the land reinforcement portion 80.

FIG. 12 shows the wiring module with the wiring substrate according tothe first embodiment of the present invention.

FIG. 12 shows a plan view and a side view of a state in which the wiringsubstrate 69 is adhered to the base portion 38 by the base adhesivelayer 59, that is, a plan view and a side view of the wiring module 49.

With reference to FIG. 12, the base adhesive layer 59 includes: landadhesion regions 50 which adhere the land portions 60 of the wiringsubstrate 69 to the base portion 38; and wire adhesion regions 53 whichadhere the wire portions 63 of the wiring substrate 69 to the baseportion 38.

Specifically, the land adhesion region 50 adheres the land reinforcementportion 80 in the land portion 60 to the base portion 38. The wireadhesion region 53 adheres the wire reinforcement portion 83 in the wireportion 63 to the base portion 38.

A width Wa3 of the wire adhesion region 53 is smaller than a width Wa0of the land adhesion region 50. Specifically, for example, the width Wa3of the wire adhesion region 53 is not less than 0.1% and not greaterthan 50% of the width Wa0 of the land adhesion region 50.

It should be noted that the width Wa0 of the land adhesion region 50 maybe smaller than the width Wb0 of the land portion 60 or may be equal tothe width Wb0 of the land portion 60. In addition, the width Wa3 of thewire adhesion region 53 may be smaller than the width Wb3 of the wireportion 63 or may be equal to the width Wb3 of the wire portion 63.

The land adhesion region 50 has a length La1 along the substrateextending direction. The wire adhesion region 53 has a length La3 alongthe extending direction of the wiring substrate 69. The length La1 ofthe land adhesion region 50 is smaller than the length La3 of the wireadhesion region 53. In other words, the length La1 in the substrateextending direction of the land adhesion region 50 is smaller than thelength La3 in the substrate extending direction of the wire adhesionregion 53.

For example, the width Wa0 of the land adhesion region 50 is smallerthan the length La1 in the substrate extending direction of the landadhesion region 50.

For example, an area Sa0 of the land adhesion region 50 is not less than20% and not greater than 1000% of an area Sa3 of the wire adhesionregion 53.

For example, a thickness Ta0 of the base adhesive layer 59 is not lessthan 0.25% and not greater than 5% of the width Wa0 of the land adhesionregion 50. The thickness Ta0 of the base adhesive layer 59 is not lessthan 0.5% and not greater than 20% of the width Wa3 of the wire adhesionregion 53.

The land adhesion region 50 has an inside region 51 and two outsideregions 52, for example. The outside regions 52 are respectivelypositioned at both ends in the length direction of the land adhesionregion 50 and are connected to the inside region 51. In other words, theoutside regions 52 are respectively connected to both ends in thesubstrate extending direction of the inside region 51. Specifically,each outside region 52 is connected between an end in the substrateextending direction of the inside region 51 and a wire adhesion region53.

The land adhesion region 50 may be configured to have one outside region52, instead of two outside regions 52. In this case, the outside region52 is positioned at one end in the length direction of the land adhesionregion 50 and is connected to the inside region 51.

The inside region 51 has a width Wa1 that corresponds to the width Wa0.The outside region 52 has a width Wa2. The width Wa1 of the insideregion 51 and the width Wa2 of the outside region 52 are the length ofthe inside region 51 and the length of the outside region 52 in thesubstrate width direction, respectively.

For example, the width Wa2 of the outside region 52 is smaller than thewidth Wa1 of the inside region 51. In addition, for example, the widthWa2 of the outside region 52 is greater than the width Wa3 of the wireadhesion region 53. For example, the width Wa2 of the outside region 52continuously becomes smaller from the inside region 51 toward the wireadhesion region 53. That is, the width Wa2 of the outside region 52continuously becomes smaller toward the wire adhesion region 53connected to the outside region 52.

The outside region 52 has a length La12 along the extending direction ofthe wiring substrate 69. For example, the relationship between the widthWa2 of the outside region 52 and the length La12 of the outside region52 is expressed by the formula (3) below.

0<La12/Wa2≦10  (3)

For example, an area Sa1 of the inside region 51 is not less than 200%and not greater than 1000% of an area Sa2 of the outside region 52.

In a plan view from above the wiring substrate 69, the power generatingelement 19 is disposed such that a center portion of the powergenerating element 19, specifically, the center Cc of the powergenerating element 19, is included in the inside region 51.

For example, in a plan view from above the wiring substrate 69, adistance da1 from the power generating element 19 to the wire adhesionregion 53 in the substrate extending direction is greater than adistance da2 from the power generating element 19 to its correspondingend of the land adhesion region 50 in the width direction of the landadhesion region 50, i.e., in the substrate width direction.

Specifically, for example, in a plan view from above the wiringsubstrate 69, the distance da1 from the power generating element 19 tothe wire adhesion region 53 in the substrate extending direction is notless than 200% and not greater than 2000% of the distance da2 from thepower generating element 19 to the end of the land adhesion region 50 inthe substrate width direction, for example.

Modification

FIG. 13 to FIG. 16 each show a modification of the wiring substrateaccording to the first embodiment of the present invention.

With reference to FIG. 13, the shape of the land portion 60 is differentfrom the shape of the land portion 60 shown in FIG. 9. Specifically, inthe land portion 60, each connection portion 64 between the edge 65positioned at an end of the inside region 61 and its corresponding edge66 positioned at an end of the outside region 62 forms a curve. Morespecifically, the land portion 60 has a rounded hexagonal shape.

It should be noted that the connection portion 64 between the edge 65and the edge 66 may form a continuous curve, i.e., a smoother curve.Specifically, the edge 65 and the edge 66 may form an arc, for example.

With reference to FIG. 14, the shape of the land portion 60 is differentfrom the shape of the land portion 60 shown in FIG. 9. Specifically, theland portion 60 has an elliptic shape.

With reference to FIG. 15 and FIG. 16, the land portion 60 has arectangular shape. In FIG. 16, an edge 160 positioned at an end in thesubstrate width direction of the land portion 60 and its correspondingedge 163 positioned at an end in the substrate width direction of thewire portion 63 form a straight line.

FIG. 17 to FIG. 20 each show a modification of the FPC in the wiringsubstrate according to the first embodiment of the present invention.

With reference to FIG. 17, the shape of the FPC land portion 70 isdifferent from the shape of the FPC land portion 70 shown in FIG. 10.Specifically, in the FPC land portion 70, each connection portion 74between the edge 75 positioned at an end of the inside region 71 and itscorresponding edge 76 positioned at an end of the outside region 62forms a curve. More specifically, the FPC land portion 70 has a roundedhexagonal shape.

It should be noted that the connection portion 74 between the edge 75and the edge 76 may form a continuous curve, i.e., a smoother curve.Specifically, the edge 65 and the edge 66 may form an arc, for example.

With reference to FIG. 18, the shape of the FPC land portion 70 isdifferent from the shape of the FPC land portion 70 shown in FIG. 10.Specifically, the FPC land portion 70 has an elliptic shape.

With reference to FIG. 19 and FIG. 20, the FPC land portion 70 has arectangular shape. In FIG. 20, an edge 170 positioned at an end in thesubstrate width direction of the FPC land portion 70 and itscorresponding edge 173 positioned at an end in the substrate widthdirection of the FPC wire portion 73 form a straight line.

It should be noted that, in the wiring substrate 69 according to thefirst embodiment of the present invention, the FPC 79 and thereinforcement plate 89 are configured to be fixed by the intra-substrateadhesive layer 58, but the configuration is not limited thereto. Forexample, the FPC 79 and the reinforcement plate 89 may be configured tobe fixed by being screwed.

In the wiring module 49 according to the first embodiment of the presentinvention, the wiring substrate 69 is configured to be fixed to the baseportion 38 by the base adhesive layer 59, but the configuration is notlimited thereto. For example, the wiring substrate 69 may be configuredto be fixed to the base portion 38 by being screwed.

Meanwhile, for example, in the concentrator solar cell module describedin PATENT LITERATURE 1, when sunlight is converged onto a solar cellelement by a lens, the temperature of the solar cell element becomeshigh. Heat of the solar cell element is transferred to the receiversubstrate to which the solar cell element is mounted, and thus, thereceiver substrate expands due to heat in some cases.

For example, in a situation where the receiver substrate is adhered to asurface at which the receiver substrate is placed, if the receiversubstrate expands due to heat, the receiver substrate comes to be easilydetached from the surface. Then, for example, if the portion of thereceiver substrate to which the solar cell element is mounted isdetached from the surface, the position of the solar cell element isshifted from the focal point of the lens, thus, causing decrease in thepower generating efficiency of the solar cell element in some cases.

In contrast to this, the power generation module according to the firstembodiment of the present invention includes the power generatingportion 30 and the wiring substrate 69. The power generating portion 30includes the power generating element 19. The wiring substrate 69includes the reinforcement plate 89 and the FPC 79 provided above thereinforcement plate 89. The power generating portion 30 is mounted tothe FPC land portion 70 in the FPC 79. The FPC wire portion 73 isconnected to the FPC land portion 70. The width Wf3 of the FPC wireportion 73 is smaller than the width Wf0 of the FPC land portion 70.

With this configuration, the wiring substrate 69 having a certain degreeof flexibility can be further provided with a feature that the FPC wireportion 73 more easily bends than the FPC land portion 70. Accordingly,for example, even in a case where compressive stress in the extendingdirection is applied to the wiring substrate 69 as a result of thermalexpansion of the wiring substrate 69, the FPC wire portion 73 bends soas to absorb the expansion in the extending direction, wherebydeformation and positional shift of the FPC land portion 70 can beprevented. Accordingly, for example, in a case where a lens having itsfocal point set at the power generating portion 30 is provided above thepower generating portion 30 mounted to the FPC land portion 70, theposition of the power generating portion 30 can be prevented from beingshifted from the focal point of the lens.

Therefore, in the power generation module according to the firstembodiment of the present invention, decrease in the power generatingefficiency due to influence of heat can be suppressed.

In the power generation module according to the first embodiment of thepresent invention, the FPC land portion 70 has the length Lf1 along theextending direction of the wiring substrate 69. The FPC wire portion 73has the length Lf3 along the extending direction of the wiring substrate69. The length Lf3 of the FPC wire portion 73 is greater than the lengthLf1 of the FPC land portion 70.

This configuration allows the FPC wire portion 73 to more easily bendthan the FPC land portion 70. Thus, the position of the power generatingportion 30 can be more reliably prevented from being shifted from thefocal point of the lens.

In the power generation module according to the first embodiment of thepresent invention, the length Lf3 of the FPC wire portion 73 is greaterthan 100% and not greater than 600% of the length Lf1 of the FPC landportion 70.

With this configuration, it is possible to make the FPC land portion 70less likely to bend than the FPC wire portion 73, while causing the FPCland portion 70 to have a size that allows the power generating portion30 to be mounted thereto.

In the power generation module according to the first embodiment of thepresent invention, the width Wf3 of the FPC wire portion 73 is not lessthan 0.1% and not greater than 50% of the width Wf0 of the FPC landportion 70.

With this configuration, for example, the width Wf3 of the FPC wireportion 73 can be reduced relative to the width Wf0 of the FPC landportion 70. Thus, it is possible to provide the FPC wire portion 73 witha feature that the FPC wire portion 73 more easily bends than the FPCland portion 70. In addition, the width Wf3 of the FPC wire portion 73can be increased to an extent that the strength of the FPC wire portion73 does not pose a problem.

In the power generation module according to the first embodiment of thepresent invention, the FPC land portion 70 has the inside region 71 andthe outside region 72. The inside region 71 has the width Wf1. Theoutside region 72 is positioned at at least one end in the lengthdirection of the FPC land portion 70, is connected to the inside region71, and has the width Wf2. The width Wf2 of the outside region 72 issmaller than the width Wf1 of the inside region 71 and is greater thanthe width Wf3 of the FPC wire portion 73.

With this configuration, for example, heat transferred from the powergenerating portion 30 to the inside region 71 can be efficientlydissipated via the outside region 72 to the FPC wire portion 73.

In the power generation module according to the first embodiment of thepresent invention, the outside region 72 is positioned at each of bothends in the length direction of the FPC land portion 70. The width Wf2of the outside region 72 is smaller than the width Wf1 of the insideregion 71 and is greater than the width Wf3 of the FPC wire portion 73.

With this configuration, heat in the inside region 71 can be dissipatedto both of the FPC wire portions 73 connected to the respective outsideregions 72.

In the power generation module according to the first embodiment of thepresent invention, the width Wf2 of the outside region 72 becomessmaller from the inside region 71 toward the FPC wire portion 73.

With this configuration, heat in the outside region 72 can beefficiently dissipated to the FPC wire portion 73.

In the power generation module according to the first embodiment of thepresent invention, the outside region 72 has the length Lf12 along theextending direction of the wiring substrate 69. The relationship betweenthe width Wf2 of the outside region 72 and the length Lf12 of theoutside region 72 satisfies the formula below.

0<(Lf12/Wf2)≦10

With this configuration, heat in the outside region 72 can be moreefficiently dissipated to the FPC wire portion 73.

In the power generation module according to the first embodiment of thepresent invention, in a plan view from above the wiring substrate 69,the power generating portion 30 is disposed such that a center portionof the power generating portion 30 is included in the inside region 71.

With this configuration, the power generating portion 30 can be disposedat a position separated to some extent from the FPC wire portion 73.Thus, positional shift of the power generating portion 30 due toinfluence of bending of the FPC wire portion 73 can be more reliablyprevented.

In the power generation module according to the first embodiment of thepresent invention, the area Sf1 of the FPC land portion 70 is not lessthan 20% and not greater than 1000% of the area of the FPC wire portion73.

With this configuration, it is possible to make the FPC land portion 70less likely to bend than the FPC wire portion 73, while causing the FPCland portion 70 to have a size that allows the power generating portion30 to be mounted thereto.

In the power generation module according to the first embodiment of thepresent invention, the land reinforcement portion 80 in thereinforcement plate 89 is fixed to the FPC land portion 70. The wirereinforcement portion 83 is fixed to the FPC wire portion 73. The widthWs3 of the wire reinforcement portion 83 is smaller than the width Ws0of the land reinforcement portion 80.

This configuration allows the FPC wire portion 73 to more easily bendthan the FPC land portion 70.

In the power generation module according to the first embodiment of thepresent invention, the reinforcement plate 89 is adhered to the baseportion 38 by the base adhesive layer 59. The land adhesion region 50 inthe base adhesive layer 59 adheres the land reinforcement portion 80 tothe base portion 38. The wire adhesion region 53 adheres the wirereinforcement portion 83 to the base portion 38. The width Wa3 of thewire adhesion region 53 is smaller than the width Wa0 of the landadhesion region 50.

With this configuration, in a state where the wiring substrate 69 isadhered to the base portion 38, the wire reinforcement portion 83 isallowed to be more easily detached from the base portion 38, than theland reinforcement portion 80. Accordingly, for example, even whencompressive stress in the extending direction is applied to the wiringsubstrate 69 as a result of thermal expansion of the wiring substrate69, the wire reinforcement portion 83 and the FPC wire portion 73 whichare in a state of being fixed to each other bend while being detachedfrom the base portion 38 so as to absorb the expansion in the extendingdirection. Accordingly, deformation and positional shift of the FPC landportion 70 can be prevented.

In the power generation module according to the first embodiment of thepresent invention, the outside region 72 is positioned at at least oneend in the length direction of the FPC land portion 70, is connected tothe inside region 71, and has the width Wf2. The width Wf1 of the insideregion 71 is greater than the width Wf2 of the outside region 72. Eachedge 75 of the inside region 71 is positioned at an end of the insideregion 71 in the width direction of the FPC land portion 70. Each edge76 of the outside region 72 is connected to its corresponding edge 75 ofthe inside region 71, and is positioned at an end of the outside region72 in the width direction of the FPC land portion 70. The angle betweenthe edge 75 and the edge 76 is greater than 90 degrees and not greaterthan 170 degrees.

Thus, with the configuration in which the angle in the FPC land portion70 is set to be an obtuse angle, for example, in a case where the FPC 79and the reinforcement plate 89 in the wiring substrate 69 are adhered toeach other, it is possible to suppress detachment between the FPC 79 andthe reinforcement plate 89 at a corner of the FPC land portion 70 due toinfluence of dew condensation or the like.

In the wiring substrate according to the first embodiment of the presentinvention, the land portion 60 has a shape that allows the powergenerating portion 30 to be mounted to the land portion 60. The widthWb3 of the wire portion 63 is smaller than the width Wb0 of the landportion 60. Each of the land portion 60 and the wire portion 63includes: the reinforcement plate 89 formed of metal; and a flexibleprinted circuit provided above the reinforcement plate 89. The landportion 60 has the inside region 61 and the outside region 62. Theinside region 61 has the width Wb1. The outside region 62 is positionedat at least one end in the length direction of the land portion 60, isconnected to the inside region 61, and has the width Wb2. The width Wb1of the inside region 61 is greater than the width Wb2 of the outsideregion 62. Each edge 65 of the inside region 61 is positioned at an endof the inside region 61 in the width direction of the land portion 60.Each edge 66 of the outside region 62 is connected to its correspondingedge of the inside region 61, and is positioned at an end of the outsideregion 62 in the width direction of the land portion 60. The anglebetween the edge 65 of the inside region 61 and the edge 66 of theoutside region 62 is greater than 90 degrees and not greater than 170degrees.

Thus, with the configuration in which the angle in the land portion 60is set to be an obtuse angle, for example, in a case where the flexibleprinted circuit 79 and the reinforcement plate 89 in the wiringsubstrate 69 are adhered to each other, it is possible to suppressdetachment between the flexible printed circuit 79 and the reinforcementplate 89 at a corner of the land portion 60 due to influence of dewcondensation or the like. In addition, in a case where the wiringsubstrate 69 and the base portion 38 at which the wiring substrate 69 isplaced are adhered to each other, it is possible to suppress detachmentof the land portion 60 from the base portion 38 due to influence of dewcondensation or the like.

Therefore, in the wiring substrate according to the first embodiment ofthe present invention, it is possible to suppress decrease in the powergenerating efficiency due to influence of dew condensation or the like.

In a modification of the power generation module according to the firstembodiment of the present invention, the connection portion between theedge 75 of the inside region 71 and the edge 76 of the outside region 72forms a curve.

Thus, with the configuration in which roundness is provided to the FPCland portion 70 to reduce corners, it is possible to more reliablyprevent detachment between the FPC 79 and the reinforcement plate 89 dueto influence of dew condensation or the like.

In a modification of the power generation module according to the firstembodiment of the present invention, the connection portion between theedge 75 of the inside region 71 and the edge 76 of the outside region 72forms a continuous curve.

This configuration can make smoother the periphery of the FPC landportion 70. Thus, it is possible to more reliably prevent detachmentbetween the FPC 79 and the reinforcement plate 89 due to influence ofdew condensation or the like.

In a modification of the wiring substrate according to the firstembodiment of the present invention, the connection portion between theedge 65 of the inside region 61 and the edge 66 of the outside region 62is a curve.

Thus, with the configuration in which roundness is provided to the landportion 60 to reduce corners, for example, in a case where the flexibleprinted circuit 79 and the reinforcement plate 89 are adhered to eachother in the wiring substrate 69, it is possible to suppress detachmentbetween the flexible printed circuit 79 and the reinforcement plate 89due to influence of dew condensation or the like. In addition, in a casewhere the wiring substrate 69 and the base portion 38 at which thewiring substrate 69 is placed are adhered to each other, it is possibleto suppress detachment of the land portion 60 from the base portion 38due to influence of dew condensation or the like.

Therefore, in a modification of the wiring substrate according to thefirst embodiment of the present invention, it is possible to suppressdecrease in the power generating efficiency due to influence of dewcondensation or the like.

In a modification of the wiring substrate according to the firstembodiment of the present invention, the connection portion between theedge 65 of the inside region 61 and the edge 66 of the outside region 62forms a continuous curve.

This configuration can make further smoother the periphery of the landportion 60. Thus, it is possible to more reliably prevent detachmentbetween the flexible printed circuit 79 and the reinforcement plate 89due to influence of dew condensation or the like. In addition, it ispossible to more reliably prevent detachment of the land portion 60 fromthe base portion due to influence of dew condensation or the like.

Next, another embodiment of the present invention will be described withreference to the drawings. It should be noted that the same orcorresponding parts are denoted by the same reference signs, anddescription thereof is not repeated.

Second Embodiment

The present embodiment relates to a wiring substrate that does notinclude the FPC, compared with the wiring substrate according to thefirst embodiment. Except the contents described below, this photovoltaicapparatus is the same as that according to the first embodiment.

In the present embodiment, the photovoltaic module 10 includes a wiringsubstrate 269 instead of the wiring substrate 69 in the photovoltaicmodule 10 according to the first embodiment. Specifically, the wiringsubstrate 269 includes another kind of substrate instead of the FPC 79,and does not include the reinforcement plate 89. The wiring substrate269 is the same as the wiring substrate 69, except the contentsdescribed below.

FIG. 21 is a perspective view showing a state of the power generatingportion mounted to the wiring substrate according to the secondembodiment of the present invention.

With reference to FIG. 21, the wiring substrate 269 includes: aconductive portion 277; and an insulating portion 278 which covers theconductive portion 277. The power generating portion 30 is mounted to aland portion 260 of the wiring substrate 269. Specifically, an opening268 is provided to the land portion 260. In the opening 268, theinsulating portion 278 does not cover the upper side of the conductiveportion 277, and thus, the conductive portion 277 is exposed. The powergenerating portion 30 is electrically connected to the conductiveportion 277 in the opening 268.

The conductive portion 277 connects, in series, the power generatingportion 30 mounted in the land portion 260 and the power generatingportion 30 mounted in another land portion 260 adjacent to the landportion 260, for example.

FIG. 22 is a cross-sectional view showing a cross section, along a linethat corresponds to the VI-VI line in FIG. 4, of the photovoltaic moduleaccording to the second embodiment of the present invention.

With reference to FIG. 22, the wiring substrate 269 is placed at theupper main surface of the base portion 38. The power generating element19 is housed in the package 18. The power generating element 19 ismounted to the wiring substrate 269 in a state of being housed in thepackage 18. Specifically, the electrode not shown of the powergenerating element 19 is connected to the conductive portion 277 of thewiring substrate 269, via the package electrode 20 provided so as topenetrate the bottom of the package 18.

FIG. 23 is a cross-sectional view showing a cross section, along a linethat corresponds to the VII-VII line in FIG. 4, of the wiring module andthe power generating portion in the photovoltaic module according to thesecond embodiment of the present invention.

FIG. 23 also shows an adhesive layer not shown in FIG. 22, for example.Specifically, with reference to FIG. 23, the power generating portion 30is mounted to the wiring module 49, specifically, the wiring substrate269 of the wiring module 49. The wiring substrate 269 and the baseportion 38 are adhered together by the base adhesive layer 59.

In the opening 268 in the wiring substrate 269, the insulating portion278 does not cover the upper side of the conductive portion 277, andthus, a part of the conductive portion 277, specifically, a part of aconductive portion 277A and a part of a conductive portion 277B, isexposed.

The package electrode 20A and the package electrode 20B are connectedby, for example, soldering to the conductive portion 277A and theconductive portion 277B, respectively.

The package 18 supports the ball lens 17 at the edge of the side wall ofthe package 18, and fixes the focal point of the ball lens 17 to thepower generating element 19.

FIG. 24 shows the wiring substrate according to the second embodiment ofthe present invention.

FIG. 24 shows a plan view and a side view of a part of the wiringsubstrate 269. With reference to FIG. 24, the wiring substrate 269includes a plurality of land portions 260 and a plurality of wireportions 263.

The power generating portion 30 including the power generating element19 is mounted to the land portion 260. The wire portion 263 iselectrically connected to the power generating element 19. The wireportion 263 electrically connects the land portions 260 that areadjacent to each other, i.e., the power generating portions 30 that areadjacent to each other.

A length Lr2 of the wire portion 263 in the extending direction of thewiring substrate 269 is greater than a length Lr1 of the land portion260 in the extending direction. Hereinafter, the extending direction ofthe wiring substrate 269 will also be referred to as a substrateextending direction.

A width Wr3 of the wire portion 263 is smaller than a width Wr0 of theland portion 260. The width Wr0 of the land portion 260 and the widthWr3 of the wire portion 263 respectively are the length of the landportion 260 and the length of the wire portion 263, in a direction thatcrosses the substrate extending direction, specifically, in a directionperpendicular to the substrate extending direction, for example.Hereinafter, the direction that crosses the substrate extendingdirection, i.e., the width direction of the land portion 260, will alsobe referred to as a substrate width direction.

The width Wr0 of the land portion 260 is not less than 200% and notgreater than 1000% of the width Wr3 of the wire portion 263, forexample.

The length Lr1 in the substrate extending direction of the land portion260 is greater than the width Wr0 of the land portion 260.

For example, the land portion 260 has an inside region 261 and twooutside regions 262. The outside regions 262 are respectively connectedto both ends in the substrate extending direction of the inside region261. Specifically, each outside region 262 is connected between an endin the substrate extending direction of the inside region 261 and a wireportion 263.

The number of the outside regions 262 of the land portion 260 may beone. In this case, the outside region 262 is connected to either one ofthe ends in the substrate extending direction of the inside region 261,for example.

The inside region 261 has a width Wr1 that corresponds to the width Wr0.The outside region 262 has a width Wr2. The width Wr1 of the insideregion 261 and the width Wr2 of the outside region 262 are the length ofthe inside region 261 and the length of the outside region 262 in thesubstrate width direction, respectively.

For example, the width Wr2 of the outside region 262 is smaller than thewidth Wr1 of the inside region 261. In addition, for example, the widthWr2 of the outside region 262 is greater than the width Wr3 of the wireportion 263.

For example, the width Wr2 of outside region 262 continuously becomessmaller toward its corresponding wire portion 263 to which the outsideregion 262 is connected.

For example, the relationship between the width Wr2 of the outsideregion 262 and the length Lr12 in the substrate extending direction ofthe outside region 262 is expressed by the formula (4) below.

0<Lr12/Wr2≦10  (4)

For example, an area Sr1 of the inside region 261 is greater than anarea Sr2 of the outside region 262. Specifically, for example, the areaSr1 of the inside region 261 is not less than 200% and not greater than1000% of the area Sr2 of the outside region 262.

For example, in a plan view from above the wiring substrate 269,specifically, in a plan view in a direction from above the wiringsubstrate 269 toward the mounting surface for the power generatingportion 30, the power generating portion 30 is disposed such that acenter portion of the power generating portion 30, specifically, thecenter Ce of the power generating portion 30, is included in the insideregion 261.

For example, in a plan view from above the wiring substrate 269, adistance dr1 from the power generating portion 30 to the wire portion263 in the substrate extending direction is greater than a distance dr2from the power generating portion 30 to an end of the land portion 260in the substrate width direction.

For example, the wiring substrate 269 has an electrode for soldering thepower generating portion 30. Specifically, for example, the electrode isthe exposed portion of the conductive portion 277 in the opening 268,and is provided so as to be included in the inside region 261.

For example, not less than 80% of the mounting region 31 is included inthe inside region 261, the mounting region 31 being the region where thepower generating portion 30 is mounted in the land portion 260. In theexample shown in FIG. 24, 100% of the mounting region 31 is included inthe inside region 261.

For example, a thickness Tr3 of the wire portion 263 is not less than 1%and not greater than 50% of the width Wr3 of the wire portion 263.

The inside region 261 has edges 265. Each edge 265 is positioned at anend of the inside region 261 in the substrate width direction. Theoutside region 262 has edges 266. Each edge 266 is positioned at an endof the outside region 262 in the substrate width direction.

The edge 265 and the edge 266 are connected to each other. An angle αbetween the edge 265 and the edge 266 is greater than 90 degrees and notgreater than 170 degrees, for example.

The other configurations and operation are the same as those of thephotovoltaic apparatus according to the first embodiment, and thus,detailed description thereof is not repeated here.

The above embodiments are merely illustrated in all aspects and shouldnot be recognized as being restrictive. The scope of the presentinvention is defined by the scope of the claims rather than by thedescription above, and is intended to include meaning equivalent to thescope of the claims and all modifications within the scope.

The above description includes the features in the additional notesbelow.

[Additional Note 1]

A power generation module including:

-   -   a power generating portion including a power generating element;        and    -   a wiring substrate, wherein

the wiring substrate includes:

-   -   a reinforcement plate; and    -   a flexible printed circuit provided above the reinforcement        plate,

the flexible printed circuit has:

-   -   a land portion configured to have the power generating portion        mounted thereto; and    -   a wire portion whose length in an extending direction of the        wiring substrate is greater than a length in the extending        direction of the land portion,

a width of the wire portion is smaller than a width of the land portion,

the power generation module is used in a photovoltaic apparatus, and

in the photovoltaic apparatus, sunlight converged by a lens is appliedto the power generating portion.

[Additional Note 2]

A wiring substrate including:

-   -   a land portion configured to have a power generating portion        mounted thereto, the power generating portion including a power        generating element; and    -   a wire portion, wherein

a width of the wire portion is smaller than a width of the land portion,

each of the land portion and the wire portion includes:

-   -   a reinforcement plate formed of metal; and    -   a flexible printed circuit provided above the reinforcement        plate,

the land portion has:

-   -   a first region; and    -   a second region connected to an end of the first region in an        extending direction of the wiring substrate,

an angle between an edge of the first region and an edge of the secondregion is greater than 90 degrees and not greater than 170 degrees, theedge of the first region being positioned at an end of the first regionin a width direction of the land portion, the edge of the second regionbeing positioned at an end of the second region in the width direction,the edge of the second region being connected to the edge of the firstregion,

the wiring substrate is used in a photovoltaic apparatus, and

in the photovoltaic apparatus, sunlight converged by a lens is appliedto the power generating portion.

[Additional Note 3]

A wiring substrate including:

-   -   a land portion configured to have a power generating portion        mounted thereto, the power generating portion including a power        generating element; and    -   a wire portion, wherein

a width of the wire portion is smaller than a width of the land portion,

each of the land portion and the wire portion includes:

-   -   a reinforcement plate formed of metal; and    -   a flexible printed circuit provided above the reinforcement        plate,

the land portion has:

-   -   a first region; and    -   a second region connected to an end of the first region in an        extending direction of the wiring substrate,

a connection portion between an edge of the first region and an edge ofthe second region is a curve, the edge of the first region beingpositioned at an end of the first region in a width direction of theland portion, the edge of the second region being positioned at an endof the second region in the width direction, the edge of the secondregion being connected to the edge of the first region,

the wiring substrate is used in a photovoltaic apparatus, and

in the photovoltaic apparatus, sunlight converged by a lens is appliedto the power generating portion.

REFERENCE SIGNS LIST

-   -   10 photovoltaic module    -   12 photovoltaic panel    -   13 sun direction sensor    -   14 frame part    -   17 ball lens    -   18 package    -   19 power generating element    -   20, 20A, 20B package electrode    -   25 concentrating portion    -   26 Fresnel lens    -   27 wall portion    -   29 power generation module    -   30, 30P1, 30P2, 30Q1, 30Q2, 30R1, 30R2 power generating portion    -   31 mounting region    -   32, 32A, 32B, 32C, 32D, 32E, 32F, 32G, 32H, 32I, 32J        strip-shaped substrate    -   33, 33H, 33I, 33J, 33K, 33L, 33M, 33N, 33O, 33P coupling portion    -   38 base portion    -   39 lead wire    -   40 pedestal    -   42A, 42B element electrode    -   46 base    -   48 post    -   49 wiring module    -   50 land adhesion region    -   51, 61, 71, 261 inside region    -   52, 62, 72, 262 outside region    -   53 wire adhesion region    -   58 intra-substrate adhesive layer    -   59 base adhesive layer    -   60, 260 land portion    -   63, 263 wire portion    -   64, 74 connection portion    -   65, 66, 75, 76, 160, 163, 170, 173, 265, 266 edge    -   68, 268 opening    -   69, 269 wiring substrate    -   70 FPC land portion    -   73 FPC wire portion    -   77, 77A, 77B, 277, 277A, 277B conductive portion    -   78, 278 insulating portion    -   79 FPC    -   80 land reinforcement portion    -   83 wire reinforcement portion    -   89 reinforcement plate    -   90 function part    -   101 photovoltaic apparatus    -   Cc, Ce center    -   FL light receiving surface

1. A power generation module comprising: a power generating portionincluding a power generating element; and a wiring substrate, whereinthe wiring substrate includes: a reinforcement plate; and a flexibleprinted circuit provided above the reinforcement plate, the flexibleprinted circuit has: an FPC land portion configured to have the powergenerating portion mounted thereto; and an FPC wire portion connected tothe FPC land portion, and a width of the FPC wire portion is smallerthan a width of the FPC land portion.
 2. The power generation moduleaccording to claim 1, wherein the FPC land portion has a length along anextending direction of the wiring substrate, the FPC wire portion has alength along the extending direction of the wiring substrate, and thelength of the FPC wire portion is greater than the length of the FPCland portion.
 3. The power generation module according to claim 2,wherein the length of the FPC wire portion is greater than 100% and notgreater than 600% of the length of the FPC land portion.
 4. The powergeneration module according to claim 1, wherein the width of the FPCwire portion is not less than 0.1% and not greater than 50% of the widthof the FPC land portion.
 5. The power generation module according toclaim 1, wherein the FPC land portion has a first region and a secondregion, the first region has a first width, the second region ispositioned at at least one end in a length direction of the FPC landportion, the second region being connected to the first region, thesecond region having a second width, and the second width is smallerthan the first width and is greater than the width of the FPC wireportion.
 6. The power generation module according to claim 1, whereinthe FPC land portion has a first region and a second region, the firstregion has a first width, the second region is positioned at each ofboth ends in a length direction of the FPC land portion, the secondregion being connected to the first region, the second region having asecond width, and the second width is smaller than the first width andis greater than the width of the FPC wire portion.
 7. The powergeneration module according to claim 5, wherein the second width becomessmaller from the first region toward the FPC wire portion.
 8. The powergeneration module according to claim 5, wherein the second region has alength along an extending direction of the wiring substrate, andrelationship between the second width and the length of the secondregion satisfies a formula below,0<(Lf12/Wf2)≦10 where Wf2 is the second width and Lf12 is the length ofthe second region.
 9. The power generation module according to claim 5,wherein in a plan view from above the wiring substrate, the powergenerating portion is disposed such that a center portion of the powergenerating portion is included in the first region.
 10. The powergeneration module according to claim 1, wherein an area of the FPC landportion is not less than 20% and not greater than 1000% of an area ofthe FPC wire portion.
 11. The power generation module according to claim1, wherein the reinforcement plate has: a land reinforcement portionfixed to the FPC land portion; and a wire reinforcement portion fixed tothe FPC wire portion, and a width of the wire reinforcement portion issmaller than a width of the land reinforcement portion.
 12. The powergeneration module according to claim 11, wherein the reinforcement plateis adhered to a base portion by an adhesive layer, the adhesive layerhas: a land adhesion region configured to adhere the land reinforcementportion to the base portion; and a wire adhesion region configured toadhere the wire reinforcement portion to the base portion, and a widthof the wire adhesion region is smaller than a width of the land adhesionregion.
 13. The power generation module according to claim 1, whereinthe FPC land portion has a first region and a second region, the firstregion has a first width, the second region is positioned at at leastone end in a length direction of the FPC land portion, the second regionbeing connected to the first region, the second region having a secondwidth, the first width is greater than the second width, and an anglebetween an edge of the first region and an edge of the second region isgreater than 90 degrees and not greater than 170 degrees, the edge ofthe first region being positioned at an end of the first region in awidth direction of the FPC land portion, the edge of the second regionbeing positioned at an end of the second region in the width direction,the edge of the second region being connected to the edge of the firstregion.
 14. The power generation module according to claim 1, whereinthe FPC land portion has a first region and a second region, the firstregion has a first width, the second region is positioned at at leastone end in a length direction of the FPC land portion, the second regionbeing connected to the first region, the second region having a secondwidth, the first width is greater than the second width, and aconnection portion between an edge of the first region and an edge ofthe second region forms a curve, the edge of the first region beingpositioned at an end of the first region in a width direction of the FPCland portion, the edge of the second region being positioned at an endof the second region in the width direction, the edge of the secondregion being connected to the edge of the first region.
 15. The powergeneration module according to claim 14, wherein the connection portionbetween the edge of the first region and the edge of the second regionforms a continuous curve.
 16. A wiring substrate, the wiring substrateconfigured to have a power generating portion mounted thereto, thewiring substrate comprising a land portion and a wire portion, whereinthe land portion has a shape that allows the power generating portion tobe mounted to the land portion, a width of the wire portion is smallerthan a width of the land portion, each of the land portion and the wireportion includes: a reinforcement plate formed of metal; and a flexibleprinted circuit provided above the reinforcement plate, the land portionhas a first region and a second region, the first region has a firstwidth, the second region is positioned at at least one end in a lengthdirection of the land portion, the second region being connected to thefirst region, the second region having a second width, the first widthis greater than the second width, and an angle between an edge of thefirst region and an edge of the second region is greater than 90 degreesand not greater than 170 degrees, the edge of the first region beingpositioned at an end of the first region in a width direction of theland portion, the edge of the second region being positioned at an endof the second region in the width direction, the edge of the secondregion being connected to the edge of the first region.
 17. A wiringsubstrate, the wiring substrate configured to have a power generatingportion mounted thereto, the wiring substrate comprising a land portionand a wire portion, wherein the land portion has a shape that allows thepower generating portion to be mounted to the land portion, a width ofthe wire portion is smaller than a width of the land portion, each ofthe land portion and the wire portion includes: a reinforcement plateformed of metal; and a flexible printed circuit provided above thereinforcement plate, the land portion has a first region and a secondregion, the first region has a first width, the second region ispositioned at at least one end in a length direction of the landportion, the second region being connected to the first region, thesecond region having a second width, the first width is greater than thesecond width, and a connection portion between an edge of the firstregion and an edge of the second region is a curve, the edge of thefirst region being positioned at an end of the first region in a widthdirection of the land portion, the edge of the second region beingpositioned at an end of the second region in the width direction, theedge of the second region being connected to the edge of the firstregion.
 18. The wiring substrate according to claim 17, wherein theconnection portion between the edge of the first region and the edge ofthe second region forms a continuous curve.